METAL-TRANSFER-MICROMOLDED RF COMPONENTS FOR SYSTEM-ON-PACKAGE (SOP)
Yanzhu Zhao, Yong-Kyu Yoon and Mark Allen
This paper reports a metal-transfer-micromolding (MTM) technique for simultaneous implementation of metallized high aspect ratio molded polymer RF passive components, as well as an organic RF circuit board, in a high performance and cost-effective fashion. A system on package (SOP) integration scheme of air lifted RF components can be realized by this process. Two test vehicles have been utilized to demonstrate the feasibility of the proposed process: planar coplanar waveguide (CPW)-based band stop filters and an airlifted monopole antenna array, both operating in Ka-band. The measured filter characteristic shows a loss of less than 2.5 dB in passband and 20 dB in stopband, which agrees well with HFSS10.0 simulations. The monopole antennas show good radiation performance and the 10 dB bandwidths at the resonant radiation frequencies are as large as 21.5% for the tested structures.
Keywords: Band pass filters, Circuit testing, Coplanar waveguides, Metallization, Packaging, Planar waveguides, Polymers, Printed circuits, Radio frequency and Vehicles