RELIABILITY OF CU/NIFE AND CU/NI METACONDUCTOR DEVICES FOR RF APPLICATIONS

Timothy Clingenpeel, Arian Rahimi and Yong-Kyu Yoon

This work presents the thermal reliability test results of a metaconductor device on a glass substrate. Custom thermal cycling testing between room temperature and 100 °C has been performed for both Cu/Ni and Cu/NiFe metaconductor based transmission lines. The overall electrical performance has been well preserved between 300 kHz and 12 GHz. After a high temperature annealing treatment with 400 °C for 2 hours, Cu/Ni metaconductor transmission lines also maintain ferromagnetic performance reasonably well while some samples show delamination due to thermal stress cracking the glass beneath the traces. While both Cu/Ni and Cu/NiFe devices show high resilience to the thermal cycling, Cu/Ni devices seem less susceptible to oxidation and other defects.

Keywords: thermal reliability, skin effect suppression and Cu/NiFe nano-superlattice conductors

ARTICLE LINK

Return to publications