MILLIMETER-WAVE WIRELESS CHIP-TO-CHIP COMMUNICATIONS IN SYSTEM-IN-PACKAGING USING COMPACT THROUGH GLASS VIA-INTEGRATED ANTENNAS
Seahee Hwangbo, Aric B. Shorey and Yong-Kyu Yoon
V-band (40 GHz - 75 GHz) wireless in-plane chip-to-chip (C2C) communications in 3D System-in-Packaging (SiP) are demonstrated using compact and highly power efficient omni-directional Through Glass Via (TGV)-integrated antennas. As a test vehicle, 62 GHz TGV-integrated antennas are designed in a glass substrate and their RF parameters such as S-parameters (S11 and S21), radiation patterns, and gains are studied. The antennas are micro-fabricated and characterized. Wireless intra-/inter-chip signal transmissions between antennas are calculated using the Friis transmission formula, and compared with the simulated and measured ones. The experimental results are well matched with the simulated ones. The simulated peak gain and efficiency is 3.2 dBi and 94 %, respectively.
Keywords: RF/millimeter-wave antennas, omni-directional antennas, Through Glass Vias (TGVs), 3D System-in-Packaing (SiP), wireless chip-to-chip communications and wireless interconnects