THROUGH GLASS VIA BASED BAND PASS FILTER FOR 5G COMMUNICATIONS
Renuka Bowrothu, Jay Zhang and Yong-Kyu Yoon
Due to low loss electrical properties and the potential to alter the coefficient of thermal expansion, through glass via (TGV) is apt for advanced packaging and high frequency applications. In this paper we present a Half Mode Substrate Integrated Waveguide (HMSIW) based 5th order band pass filter operating in K-band. HMSIW filters are gaining attention due to the similar performance as Substrate Integrated Waveguide (SIW) filters but with more compact size, easy integration and without necessity of transitioning connectors from HMSIW to microstrip line. In addition, a Complementary Split Ring Resonator (CSRR) is integrated to HMSIW to further reduce the device size. The center frequency of the filter is designed using the CSRR structure on the top ground plane and the out of band attenuation is improved by adding spur lines to the structure. The filter design is implemented on glass as well as Rogers substrates using High Frequency Structural Simulator (HFSS) software. The RF performance of the fabricated filter matches well with that of the simulated one.
Keywords: through glass via, substrate integrated waveguide, half mode substrate integrated wavegudie, complimentary split ring resonators, spur lines and high frequency strcutural simulator (HFSS)