GLASS INTERPOSER INTEGRATED DUAL-BAND MILLIMETER WAVE TGV ANTENNA FOR INTER-/INTRA CHIP AND BOARD COMMUNICATIONS
Seahee Hwangbo, Aric B. Shorey and Yong-Kyu Yoon
A dual-band and dual-mode millimeter wave through glass via (TGV) antenna integrated in a glass interposer layer has been designed for wireless inter-/intra chip and board communications. A disc loaded TGV antenna is configured as a directional patch mode for out-of-plane communications at 62 GHz (WiGig), where the disc is a main radiating element, while the antenna operates as an omni-directional monopole mode for in-plane communications at 77 GHz (W-band), where the vertical via is a main radiating element. As the glass interposer layer serves as an antenna hosting material as well as an electromagnetic wave channel medium for wireless communications, low dielectric loss glass substrates with a loss tangent of 0.0036 are adopted.
Keywords: 3D-Integrated Circuit (IC), Glass interposer, Through glass via (TGV), Millimeter-wave antennas, inter-/intra chip and board communications and Wireless interconnects