INTEGRATED COMPACT PLANAR INVERTED-F ANTENNA (PIFA) WITH A SHORTING VIA WALL FOR MILLIMETER-WAVE WIRELESS CHIP-TO-CHIP (C2C) COMMUNICATIONS IN 3D-SIP
Seahee Hwangbo, Renuka Bowrothu, Hae-In Kim and Yong-Kyu Yoon
W-band (75 GHz - 110 GHz) wireless in-plane chip-to-chip (C2C) communications in 3D System-in-Packaging (SiP) are demonstrated using an integrated compact planar inverted-F antenna (PIFA) with a shorting via wall. As a test vehicle, a 77 GHz compact PIFA with a shorting via has been designed in a PCB substrate and their RF parameters such as reflection coefficients (S11s), antenna gains, radiation patterns have been studied. Milling machine and micro-fabrication has been utilized to implement the proposed 77 GHz PIFA with a shorting via and their RF characterization has been performed. The measured S11 results agree well with the simulated ones. The simulated efficiency and antenna peak gain is 96 % and 1.77 dBi, respectively. An antenna footprint of 0.19 mm2 excluding the feeding line is demonstrated, showing more than 50 % area reduction compared with a disc-loaded monopole antenna.
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