GLASS INTERPOSER INTEGRATED MILLIMETER WAVE ANTENNAS FOR INTER-/INTRA CHIP COMMUNICATIONS
Yong-Kyu Yoon, Seahee Hwangbo, Arian Rahimi, Sheng-Po Fang and Todd Schumann
Millimeter wave antennas are integrated in the glass interposer layer for wireless inter-/intra chip/board communications. For in-plane communication, a disc loaded monopole antenna with an omni-directional radiation pattern is designed while for out-of plane communication, a similar architecture with patch mode radiation is configured. These antennas are useful for wireless interconnects in three dimensional integrated systems in package.
Keywords: wireless interconnects, glass interposer, millimeter wave antenna, inter chip communication and intra chip communication