A WIRELESS SEQUENTIALLY ACTUATED MICROVALVE SYSTEM
Seung-Ki Baek, Yong-Kyu Yoon, Hye-Seon Jeon, Soonmin Seo and Jung-Hwan Park
A wireless microvalve system was fabricated based on induction heating for flow control in microfluidics by sequential valve opening. In this approach, we used paraffin wax as a flow plug, which can be changed from solid to liquid with adjacent heating elements operated by induction heating. Programmable opening of valves was devised by using different thermal responses of metal discs to a magnetic field. Copper and nickel discs with a diameter of 2.5 mm and various thicknesses (50, 100 and 200 µm) were prepared as heating elements by a laser cutting method, and they were integrated in the microfluidic channel as part of the microvalve. A calorimetric test was used to measure the thermal properties of the discs in terms of kinds of metal and disc thickness. Sequential openings of the microvalves were performed using the difference in the thermal response of 100 µm thick copper disc and 50 µm thick nickel disc for short-interval openings and 200 µm thick copper disc and 100-µm-thick nickel disc for long-interval openings. The thermal effect on fluid samples as a result of induction heating of the discs was studied by investigating lysozyme denaturation. More heat was generated in heating elements made of copper than in those made of nickel, implying differences in the thermal response of heating elements made of copper and nickel. Also, the thickness of the heating elements affected the thermal response in the elements. Valve openings for short intervals of 1–5 s and long intervals of 15–23 s were achieved by using two sets of heating elements. There was no significant change in lysozyme activity by increasing the temperature of the heating discs. This study demonstrates that a wireless sequentially actuated microvalve system can provide programmed valve opening, portability, ease of fabrication and operation, disposability, and low cost.
Keywords: Eddy currents, Microfluidic devices, Nickel, Temperature effect, Temperature distribution, Copper, Density distribution, Thermal properties, Phase-change materials, Metals and Microfluidics